Lucintel’s latest market report analyzed that 3D semiconductor packaging provides attractive opportunities in the consumer electronic, industrial, automotive, healthcare, IT & telecommunication, and aerospace & defense industries. The 3D semiconductor packaging market is expected to reach $8.7 billion by 2028 with a CAGR of 19%. In this market, 3D through silicon is the largest segment by technology, whereas consumer electronics is largest by end use industry.
Based on technology, the 3D semiconductor packaging market is segmented into 3D through silicon, 3D package on package, 3D fan out, 3D wire bonded, and others. The 3D through silicon segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to its high density and short connection; hence, it is preferred over package-on-package.
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The 3D Semiconductor Packaging Market is marked by the presence of several big and small players. Some of the prominent players offering 3D semiconductor packaging include Amkor Technology, ASE group, Siliconware Precision Industries, Jiangsu Changjiang Consumer, and SSS MicroTec AG.
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